White Paper 2 Part II: Released and adopted by JEDEC as JEP196

Last Updated on November 29, 2023 White Paper 2 Part II: Die-to-Die Interfaces - A Case for Lowering Component-level CDM ESD Specifications and Requirements has been Released

Revision 1.1 - Adopted as JEDEC JEP196 November 2023

This white paper on die-to-die (D2D) interfaces is an extension of the second revision of White Paper 2 on CDM target levels released in 2021. It addresses the need for a clear CDM target roadmap for D2D interfaces.

D2D interfaces are the central intellectual property (IP) blocks for a heterogeneous integration architecture. This heterogeneous integration technology, with several variants of 2.5D and 3D package integration schemes, is the key enabler for the continuation of Moore’s law and will drive the growth of the semiconductor market in the coming years.

This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces.